发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 <p>PURPOSE:The titled composition excellent in heat cycling resistance, heat resistance and moisture resistance, comprising a polyfunctional epoxy compound, a phenol novolak resin, an inorganic filler, a cure accelerator and a fluorocarbon resin. CONSTITUTION:A polyfunctional epoxy compound (A) (e.g., novolak epoxy resin) is mixed with a phenol novolak resin (B) of an unreacted monomer content <=0.5wt%, 50-80wt% inorganic filler (C) (e.g., crystalline silica powder), a cure accelerator (D) (e.g., 2-methylimidazole) and a fluoroelastomer (D) (e.g., trifluorochloroethylene/vinylidene fluoride copolymer) of a particle diameter <=50mum so that the ratio of E (pts.wt.) to (A+B+E) (pts.wt.) may be 0.02-0.3.</p>
申请公布号 JPS6241218(A) 申请公布日期 1987.02.23
申请号 JP19850181985 申请日期 1985.08.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJIMOTO TAKAMITSU;KANEGAE YUZO;KITA SHUICHI;MORIWAKI NORIMOTO;ANDO TORAHIKO
分类号 C08G59/00;C08G59/62;C08L1/00;C08L27/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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