发明名称 ADDITION TYPE IMIDE RESIN PREPOLYMER COMPOSITION
摘要 PURPOSE:To provide the titled compsn. which can be molded under low pressure and gives moldings having high adhesion and high dimensional stability, by adding N,N'-methylenebis(N-phenylmaleimide) to an addition type imide resin prepolymer. CONSTITUTION:5-60wt% N,N'-methylenebis(N-phenylmaleimide) (a) or 5-150pts. of the combined quantity of component (a) and 4,4'- diaminodiphenylmethane (b) in a molar ratio of a/b of 1.1-10.0 is added to 100pts. addition type imide resin prepolymer contg. at least 7% component having an MW of 15,000 or above, obtd. by reacting an unsaturated bisimide with a diamine or reacting maleic anhydride with a polyamine. The mixture is dissolved in a solvent such as N-methyl-pyrrolidone and thoroughly mixed. If desired, the mixture is aged for 0.5-2hr by heating it at 80 deg.C, thus obtaining a slon. of the titled prepolymer compsn. The soln. of the compsn. is then brought into a powder state, thus obtaining the titled compsn. which can be used as a molding material.
申请公布号 JPS6241262(A) 申请公布日期 1987.02.23
申请号 JP19850180131 申请日期 1985.08.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OGASAWARA KENJI;MATSUMURA MASAHIRO;MORII KENSAKU
分类号 C08L79/08;B32B15/088;B32B27/04;C08J5/24;C08K5/18;C08K5/3415;H01L23/538;H05K1/00;H05K1/03 主分类号 C08L79/08
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