| 摘要 |
PURPOSE:To provide-the title apparatus which enhances the reliability of a product (a semiconductor device) and which reduces the burden of an operator at the same time by a method wherein the mounting operation of a semiconduc tor element on a board by a manual operation and, in addition, a wire bonding operation are mechanized. CONSTITUTION:The title apparatus is featured by providing a board conveyance part 11 provided with the following: a rail 23 arranged at the lower part of a bonding head 16; and a carrier 15 in which locating holes 17 are made at a peripheral edge part in the lengthwise direction so as to travel freely along the rail 23, which sandwiches side faces of each board 2 at the inside while the side faces are being positioned by using one pair of claw parts via spring members, which holds said board and which is composed of one plate. |
