| 摘要 |
PURPOSE:To fix the relative positions of a substrate and bonding head stably with high precision by a method wherein a lighting equipment is arranged on a heater block side to irradiate an identification mark forming position with transmitted light from backside of the substrate. CONSTITUTION:A vertical through hole 16 is formed into a heater block 4 immediately below a monitor scope 3 while an optical fiber head 18 of a lighting equipment 17 is inserted upward into the vertical hole 16. In order to perform the wire bonding process, a substrate 11 is loaded upon the heater block 4 so that an identification mark A formed on the surface of substrate 11 may be positioned almost on the hole 16 to receive the transmitted light irradiating the backside of substrate 11 from the optical fiber head 18 into the monitor scope 3 for position control based on the pattern identification. |
