| 摘要 |
PURPOSE:To protect effectively an IC chip and bonding wire from the stress and contamination by the sealing resin, by bonding the protecting cap for covering the bonding ground for the wiring pattern to constitute a local sealing section, and by molding the outside of the local sealing section with resin. CONSTITUTION:A local sealing section 12 is formed by an insulating layer 14 of glass to surround an IC chip 4 and bonding ground 10 on a substrate 2, and a protecting metal cap 16 which covers the IC chip 4, bonding wire 8 and bonding ground 10 is bonded onto the insulating layer 14. Moreover, the outside of the local sealing section 12 and the substrate 2 is being molded with sealing resin 22 of epoxy resin. In this way, the stress resulted from the resin hardening and the contamination of the IC chip by the sealing resin can be prevented from being applied to the IC chip and bonding wire, without causing the resin to be contacted directly to the IC chip. |
