| 摘要 |
<p>PURPOSE:To enable to perform exfoliation work of a dicing substrate with high efficiency in a condition of high quality without depending upon hand work by a method wherein a mechanism to suck the dicing substrate, a heater to heat to melt a bonding material and a mechanism to push up to separate a pedestal are provided. CONSTITUTION:When a dicing substrate 1 cutting processed in the bonded condition to a pedestal 2 is put on a sucking mechanism 7, the pedestal 2 is made in a condition put on push up pins 8. When the sucking mechanism 7 is operated in this condition, air in a suction recess part 72 is sucked in an arrow mark B direction through a suction vent 71 to suck the dicing substrate 1, the pedestal 2 pushes down also the push up pins 8 resisting against springs 9, a microswitch 12 is made in the connected condition being pushed by the push up pins 8 to operate a heater not shown in the figure, and heating is performed from an arrow mark A direction. When a bonding material 3 bonding the pedestal 2 and the dicing substrate 1 becomes to a molten condition, the push up pins 8 are pushed up in an arrow mark C direction according to elasticity of the springs 9, while because the dicing substrate 1 is in the condition sucked to the sucking mechanism 7, when the pedestal is exfoliated, the microswitch 12 is cut at the same time, and action of the heater is stopped.</p> |
