发明名称 ELECTRONIC-PART MOUNTING PACKAGE
摘要 PURPOSE:To enhance airtight property, by providing a flange type at the bonding parts of a main body and a cap, providing protruded and recessed coupling surfaces at the bonding parts, and bonding the bonding parts by ultrasonic wave fusion. CONSTITUTION:A cap 3 is provided with a recessed hole 7 and a flange 11 as in a main body 2. A V shaped or U shaped protruded wall 13 is formed around the periphery of the lower surface of the flange 11. The surfaces of the flanges 11 of the main body 2 and the cap 3 are made to face each other, and the protruded wall 13 is coupled to the flange groove 12. When ultrasonic wave vibration is applied, the protruded wall 13 is fused. The main body 2 and the flange groove 12 are welded. Thus airtight property is enhanced.
申请公布号 JPS6237950(A) 申请公布日期 1987.02.18
申请号 JP19850177165 申请日期 1985.08.12
申请人 MATSUSHITA ELECTRONICS CORP 发明人 NOSE KOJI;IWASA HITOO
分类号 H01L23/02;B29C65/08;H01L21/50;H01L23/04;H01L23/08 主分类号 H01L23/02
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