MATERIAL FOR SPUTTERING TARGET

摘要

PURPOSE:To form a film of a uniform thickness free from defects such as pinholes on a substrate of a large area by using a circular sputtering target having an uneven or inclined surface part of a specified shape as a sputtering target for forming a thin film. CONSTITUTION:When a circular sputtering target is produced as an evaporating source for forming a thin film, the thickness of a material 2 for the target is continuously changed from the center toward the periphery by making the surface uneven so that the angle of projection of sputtered particles coincides with a direction in which the thickness of a film formed on a substrate becomes small, or the cross-section of a material 3 for the target is made symmetric with respect to rotation by providing the cross-sectional shape of a nearly triangular body of rotation. A film of a uniform thickness is formed even on a large-sized substrate by sputtering with the resulting sputtering target.