| 摘要 |
The invention principally concerns a technique of preparing a lead frame for semiconductor integrated circuits, although the technique is also applicable to other contact frames. A technique is described whereby most of the thickness of the material over the whole of the lead-frame foil blank's inner area (where the inner connections to the integrated circuit chip will eventually be) is removed from one face to make a generally robust foil with a centrally-located recess defining a much thinner inner section, the recess is filled with some "fixing" material that will both provide suppoort for and hold in position the thin innersection, and furter material is then removed from the other face of the blank so as to form the fine inner parts 25 of the lead-frame, these being firmly supported, and held in place, by the "fixing" material 23 filling what was the recess in the foil. <IMAGE> |
