Dip switch having single terminal-contact support wafer

摘要

A dual in-line package (DIP) switch includes movable terminals and fixed terminals all of which are inserted in a wafer by insert molding. The two rows of terminals have terminal portions including contact portions. The terminal portions of the two rows are disposed substantially parallel to each other and spaced apart a given distance within a casing in such a way that the corresponding contact portions can either make or break contact with each other.