| 摘要 |
PURPOSE:To provide the titled adhesive which has good adhesion and can form circuit boards having excellent resistance to moisture and heat, by uniformly dispersing a hydrophobic inorg. filler in a specified four-component adhesive compsn. consisting of a phenolic resin, etc. CONSTITUTION:The surface of an inorg. filler having a particle size of 1mu or below, such as silica, silicon carbide or alumina, is made hydrophobic by treating it with a hydrophobicity imparting agent such as dimethyldichlorosilane or gamma-chloropropylmethyldimethoxysilane. 5-40wt% said inorg. filler is dispersed in an adhesive compsn. consisting of four components of 10-50wt% phenolic resin, 35-70wt% acrylonitrile/butadiene copolymer, 2-40wt% epoxy resin and 10- 40wt% butyral resin.
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