| 摘要 |
<p>PURPOSE:To reduce a mounting area and increase its density by forming a thick film resistor on a ceramic substrate of simultaneous baking type. CONSTITUTION:A conductor paste is printed on alumina green sheet of unbaked ceramic material, laminated, pressed to be formed in multilayers, and baked to obtain a multilayer alumina ceramic material 1 formed with the first conduc tor wiring pattern 20. Then, after an electroless nickel plating 21 and an electroless gold-plating 22 are formed on the pattern 20, silver-palladium thick film conductor paste is printed, and baked to obtain a silver-palladium thick film conductor 30. Then, ruthenium oxide thick film resistance paste is printed and baked at the position not contacted with the conductor 30 on the material 1 to obtain a thick film resistor 3. Subsequently, a paste which mainly contains palladium metal particles and glass powder is so printed and baked as to be superposed on the end of the resistor 3 and the periphery of the conductor 30 to obtain an activated layer 50 for electroless plating.</p> |
