发明名称 METAL MOLD FOR MOLDING ENCAPSULATED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable shortening delivery time and realizing standardization by attaching the top and bottom forces to the base boards as a unit structure each without making the ejector pins and a return pin penetrate the base boards. CONSTITUTION:Ejector pins 31 on upper cavities 30a and ejector pins 32 and a return pin 33 on the upper surface of a subrunner 1a are penetrated a top force 30 and the flange parts thereof are held by a press plate 34 just over the top force upper surface and an ejector plate 35. The press plate 34, the ejector plate 35 and a support pillar 40 are housed in the recessed part 37a of an upper base board 37 and the support pillar 40 prevents the top force 30 from being deformed due to mold clamping pressure. Moreover, both the runner block of the bottom force and the chamber block of the top force are respectively incorporated in the upper and lower base boards as a single unit each in the same structure as those of the bottom force unit and the top force unit. By this constitution, a shortening of delivery date and standardization can be attained.
申请公布号 JPS6235630(A) 申请公布日期 1987.02.16
申请号 JP19850174366 申请日期 1985.08.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMADA HIROMICHI;TSUTSUMI KOJI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29C45/40;B29K105/20;B29L31/34 主分类号 H01L21/56
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