| 摘要 |
PURPOSE:To obtain the alkaline developing type photosensitive composition having an excellent oxygen plasma resistance property by using a polymer composition containng a specific alkaline soluble silmethylene polymer and a photosensitive agent which changes the polymer to an alkaline soluble by irradiating a ray of light to the title composition. CONSTITUTION:The title composition comprises 70-95wt% a polymer contg. 70-100wt% the alkaline soluble simethylene copolymer shown by formula Iand 30-50wt% the photosensitive agent having a function in which a film contg. the prescribed polymer is insoluble to the alkaline solution before irradiating, but changes to the alkaline soluble by irradiating the light. The title composition is developed by an alkaline developing process in which an alkaline developing type resist constituting a main resist at present is developed. The photosensitivity of the title resist is equal to or more than that of the alkaline developing type resist. Thus, the title composition is available without changing a developing process now in use. Since the title composition has the excellent oxygen plasma resistance, said composition may be used as an upper layer resist in the two layer resist process. |
