| 摘要 |
PURPOSE: To teach a bonding target point in a reference semiconductor to a wire bonder so as to enable it to accurately carry out a bonding operation when a producer semiconductor is wire-bonded, even if the bonding target point of the reference semiconductor is different from that of the product semiconductor. CONSTITUTION: A target bonding point in a reference semiconductor device is approximately detected by hand, target bonding positions 24 and 27 are automatically rearranged at the approximate target bonding points by a pattern recognition device, and a direction and a distance D to a following bonding point are programmed into the pattern recognition device, so that an automatic wire bonder proceeds automatically to a following bonding point. |
