POLYAMIDES AND HEAT-SEALABLE FILMS FORMED THEREFROM

摘要

Heat-sealable polyamide films or layers are formed from polyamides containing: (a) at least one pendant alkyl branch having 1 to 3 carbon atoms within at least two amide linkages along the polymer backbone, and (b) at least one sequence of at least seven consecutive carbon atoms, excluding carbon atoms in pendant alkyl branches, if any, within at least two amide linkages along the polymer backbone. Additionally, heat-sealable films or layers can be formed from blends containing: (a) at least one polyamide containing: (i) at least one pendant alkyl branch having 1 to 3 carbon atoms within at least two amide linkages along the polymer backbone, and (ii) at least one sequence of at least seven consecutive carbon atoms, excluding carbon atoms in pendant alkyl branches, if any, within at least two amide linkages along the polymer backbone; and (b) at least one polymer selected from polyamides, vinyl polymers, graft functionalized C2-C20 alpha-olefin polymers, ethylene/ethylenically unsaturated carboxylic acid copolymers, or ionomers.