| 摘要 |
<p>PURPOSE:An epoxy resin composition for sealing semiconductor capable of retaining reliability in an existing quality or higher even after immersion in solder, obtained by blending an epoxy resin with a specific amount of a thermoplastic resin having a softening point in a specific range. CONSTITUTION:(A) An epoxy resin such as bisphenol type epoxy resinn or phenolic novolak type epoxy resin is blended with (B) a curing promoter such as an imidazole, tertiary amine or organic phosphorus compound, (C) 1-10wt% thermoplastic resin having 150-260 deg.C, preferably 170-230 deg.C softening point, such as high-density polyethylene, polymethylpenteneor polyethylene terephthalate and, if necessary, a curing agent, a filler, a flame-retardant, etc., to give the aimed epoxy resin composition for sealing semiconductor.</p> |
