| 摘要 |
<p>PURPOSE:To detect any deviation of a probe which would cause a serious problem, in an early stage while checking the characteristics of a wafer and to prevent such problem, by additionally providing a smaller pad other than pads for electrodes. CONSTITUTION:Aluminum pads 3 having a size of about 100mumX100mum are arranged on an insulation film on a semiconductor substrate 1 including an element of a semiconductor integrated circuit device. A smaller pad 4 having a size of about 50mumX50mum is provided additionally to said pads 3. The smaller pad 4 is electrically short circuited with one of the electrode pads 3a. According to this construction, probes 5 are correctly located on and contacted with the pads 3 and the smaller pad 4 if there is no deviation between the relative positions of the probes 5 and the pads. If there is some deviation, however, the probe 5 corresponding to the smaller pad 4 will be deviated completely from the subject pad. Electrically, the pads 3a and the probes 5 are open circuited. Such deviation of the probes can be detected easily from the result of a test conducted by a tester. Accordingly, the deviation can be corrected in this stage so that the normal operation can be continued.</p> |
