发明名称 Bonding apparatus for joining an electrical component to a support
摘要 This apparatus comprises a base-plate (10), a movable bonding tool (12) fitted with a frame (14), with an electrical generator and with a resistance-heating bonding head (18), and a base (20) supporting components (22, 26) to be bonded to each other. The bonding tool (12) is mounted so as to tilt on the base-plate (10) about a horizontal pivot axis (32). Application to the bonding of electrical components (26) on a printed circuit (22). <IMAGE>
申请公布号 CH659607(A5) 申请公布日期 1987.02.13
申请号 CH19840005458 申请日期 1984.11.15
申请人 FARCO S.A. 发明人 MUELLER, CLAUDE;MATTHEY, FERNAND (-DORET)
分类号 B23K3/047;H05K13/04;(IPC1-7):B23K37/00 主分类号 B23K3/047
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