发明名称 |
Bonding apparatus for joining an electrical component to a support |
摘要 |
This apparatus comprises a base-plate (10), a movable bonding tool (12) fitted with a frame (14), with an electrical generator and with a resistance-heating bonding head (18), and a base (20) supporting components (22, 26) to be bonded to each other. The bonding tool (12) is mounted so as to tilt on the base-plate (10) about a horizontal pivot axis (32). Application to the bonding of electrical components (26) on a printed circuit (22). <IMAGE>
|
申请公布号 |
CH659607(A5) |
申请公布日期 |
1987.02.13 |
申请号 |
CH19840005458 |
申请日期 |
1984.11.15 |
申请人 |
FARCO S.A. |
发明人 |
MUELLER, CLAUDE;MATTHEY, FERNAND (-DORET) |
分类号 |
B23K3/047;H05K13/04;(IPC1-7):B23K37/00 |
主分类号 |
B23K3/047 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|