| 摘要 |
PURPOSE:To hold a lead frame between a lead frame pusher and a heat block in case of bonding process by a method wherein a pusher member holding the peripheral outside of IC chip is section-formed into multiple parts to be connected to an elasticity-deformable connector to a pusher main body at the central part in the longitudinal direction of each pusher member. CONSTITUTION:A lead frame pusher 11 composed of a pusher main body 1, pusher members 12 and an elasticity-deformable connector 13 connecting the pusher members 12 to the pusher main body 1 at the central part in the longitudinal direction of each pusher member 12 is constituted to pressure-hold a lead frame 4 loaded upon a heat block 5. When one end of pusher member 12 with the frame being held is pushed in the arrow P1 direction, the connector 13 is elasticity-deformed to be distorted in the arrow (e) direction while when both ends of pusher member 12 are pusher in the P1, P2 directions, the connector 13 is elasticity-deformed to be distorted in the arrow (f) direction making all pusher members 12 evenly abut against the lead frame 4 at the peripheral outside of IC chip 7 in every case. |
