| 摘要 |
PURPOSE:To enhance reliability in preventing cracks in a glass layer, by forming a lead piece with an iron alloy, which includes nickel and cobalt and has martensite transformation temperature of less than -55 deg.C. CONSTITUTION:A chamber is formed by a ceramic insulating substrate 4 including silicon carbide, a cap 5 and a sealing glass 6 in an airtight manner. A semiconductor element 1 is mounted on the substrate. The end parts of lead pieces 3 are introduced from the outside. Wires 2 electrically connect the lead pieces and the element 1. Those parts are contained in an integrated circuit package. The lead piece 3 comprises an iron alloy, which includes nickel and cobalt and has martensite transformation temperature of less than -55 deg.C. Out of the iron alloys, the alloy, in which the amount of Ni is 29-31wt% and the amount of Co is 12.5-15wt%, especially has the thermal expansion coefficient that is approximate to the thermal expansion coefficient of glass, therefore said ally is most suitable for the material of the lead piece 3. |
