PACKAGING SUBSTRATE FOR HYBRID OPTICAL INTEGRATION AND ITS PRODUCTION

摘要

PURPOSE: To provide a packaging substrate for hybrid optical integration capable of suppressing stress concentration to the substrate and a process for producing this packaging substrate for optical integration capable of producing the packaging substrate for hybrid optical integration having high performance without using a polishing stage and with a simple stage. CONSTITUTION: This packaging substrate for hybrid optical integration is composed of a flat substrate 1 having projecting parts 4 to mount optical elements 3 in a part, a clad disposed on this substrate 1 and an optical waveguide 2 consisting of a core 7 which is enclosed by this clad and has the refractive index higher than the refractive index of the clad. This packaging substrate for hybrid optical integration is constituted by forming the optical waveguide 2 on the flat part of the substrate 1.