| 摘要 |
<p>PURPOSE:To obtain the semiconductor elements of resin mold type easily by making mark-off lines by a scriber in the grooves etched in a wafer and breaking the wafer into semiconductor elements. CONSTITUTION:The wafer on which a plurality of semiconductor elements are formed is cut into those elements. At that time, etching of predetermined width and depth is made in a predetermined street part of the wafer. A width and a depth are not less than 40mum and 20mu, respectively. Next, mark-off lines are made by a scriber in the grooves formed by etching and then, the wafer is broken into semiconductor elements. Cosequently, the semiconductor elements of resin mold type can be obtained easily.</p> |
