| 摘要 |
PURPOSE:To stabilize the potential of a reference potential pad by a method wherein at least one layer of plural conductive layers is formed surrounding a semiconductor chip and connected to a reference potential lead so as to shorten a metal wire for connecting a reference potential point of the semiconductor chip. CONSTITUTION:A package 3 has a structure where plural conductive layers 5 and 7 connected to an external lead 4 are insulated with an insulative layer 9 each other. At least one layer out of the conductive layers 5 and 7, for example, the conductive layer 7 is provided surrounding an iland for mounting asemiconductor chip 2. The conductive layer 7 is connected to the reference lead of the external lead 4. Then, a metal wire 8 is connected from a reference potential pad 6 to the conductive layer 7 with shortest distance, thereby reducing the value of resistance of the metal wire 8. Therefore, the voltage drop by the metal wire 8 is reduced, stabilizing the potential of the pad 6. |
