| 摘要 |
PURPOSE:To solder even members having low heat resistance without giving thermal damage thereto by interposing solder and solder flux between the part to be soldered formed on an optically transparent base body and the other part to be soldered, bringing both parts into tight contact with each other under pressure and irradiating laser light to said parts thereby heating the same. CONSTITUTION:Solder paste is first coated on an electrode 2 of a flexible circuit board 1 and said electrode is subjected to preliminary soldering 3. On the other hand, the solder flux 6 is coated on an electrode 5 of a glass substrate 4 and both substrates are so superposed on each other that the electrodes 5 and 2 face each other. A transparent press plate 13 is imposed via a 'Mylar(R)' film 12 on the flexible circuit board 1 and is held pressed from above, then the laser light 14 deviated in the focus from the electrode 2 is irradiated from above the plate 13. The energy of the laser light 14 is converted to heat by the electrode 2 while said energy is hardly absorbed by the plate 13, the film 12 and the circuit board 1 when the laser light 14 is irradiated by moving the same back and forth in an arrow direction A. The soldering free from thermal damage is thus executed. |
