摘要 |
An accelerometer fabricated from a semiconductor substrate sandwiched between two non-conductive plates is shown having an inertial mass formed by etching the substrate. The mass is joined to the substrate by hinges having crossed blades to provide flexure in one direction and rigidity in other directions. The fabrication technique permits the integration of accelerometer servo and signal processing circuitry upon the same substrate in which the accelerometer mass is formed. |