| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve accuracy of alignment measurement by forming a mark having a pattern on a semiconductor substrate and measuring measurement errors directly. SOLUTION: A first mark 9 and a second mark 13 of an alignment mark, a pattern edge 35 and a pattern edge 36 indicate a section of the alignment mark. A difference between the central position 39 of the mark 9 and the central position 40 of the mark 13 is measured to obtain a displacement quantityΔX. According to the measured value of displacement of the alignment mark, a TIS value is calculated by using a formula, TIS (average value of measured value of both sides)=(ΔX0 +ΔX180 )/2, so that measurement errors of alignment mark due to displacement of light axis in an alignment inspection device can be detected. In the formula,ΔX0 stands for the measured value of displacement quantity that is measured before a semiconductor substrate is turned, andΔX180 stands for the measured value of displacement after the semiconductor substrate is turned 180 degrees.</p> |
