发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To simplify a process for dicing each unit from a multiple pattern circuit board by forming slit holes in each unit circuit beforehand, and making the length of the slit hole longer than the end surface length of the individual unit circuit board after dividing. SOLUTION: A plurality of slits 2 are discontinuously formed in a circuit board, corresponding to each unit circuit board D to be divided individually. The slit is longer than the end surface length (a) of each unit circuit board D in the P-direction. The width between slits 2 in the Q-direction is made nearly equal to the end surface width (b) of the unit circuit board D. A plurality of through-holes 3 are continuously formed in the Q-direction. The through-holes 3 have function of connecting circuit wirings on the surface and the back of the circuit board 1, and function as side surface outer electrodes at the time of product completion. Thereby the process for dicing each unit circuit board D from a multiple pattern circuit board 1 can be simplified.</p>
申请公布号 JPH1092771(A) 申请公布日期 1998.04.10
申请号 JP19960238738 申请日期 1996.09.10
申请人 SHARP CORP 发明人 YOSHIDA HIROSHI
分类号 H01L21/52;H01L21/301;H01L31/02;(IPC1-7):H01L21/301 主分类号 H01L21/52
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