Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben,申请号DE1996151761-传众专利搜索

发明名称	Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
摘要	<p>The method involves polishing the discs (10a) with a polishing head (2) by pressing them against a polishing cloth stretched over a polishing disc (13). At least one of a number of pressure chambers are pressurised at a specific pressure before the discs are polished. During the polishing process the polishing pressure is transferred to the rear surface (6) of the wafer (1) carrying the discs by the flexible bearing surface (5) of the pressurized pressure chambers. If several pressure chambers are pressurised the pressures in the chambers can be balanced</p>
申请公布号	DE19651761(A1)	申请公布日期	1998.06.18
申请号	DE1996151761	申请日期	1996.12.12
申请人	WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG, 84489 BURGHAUSEN, DE	发明人	MUELLER, PAUL, OSTERMIETHING, AT;HENNHOEFER, HEINRICH, 84503 ALTOETTING, DE;THURNER, MANFRED, ACH, AT;BUSCHHARDT, THOMAS, 84489 BURGHAUSEN, DE;MANGS, FRANZ, 84529 TITTMONING, DE;ROETTGER, KLAUS, DR., 83530 SCHNAITSEE, DE
分类号	B24B37/30;B24B41/047;B24B49/16;B25J15/06;H01L21/304;(IPC1-7):H01L21/304;B24B37/04;B28D5/02	主分类号	B24B37/30
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