| 摘要 |
PURPOSE:To achieve the simplification of a constitution and the reduction of man- hours, by providing a part member of specified thickness on the side surface of LED array which is fixed at the reference position on a substrate, and aligning successively LED arrays in contact with each other on the side surface thereof. CONSTITUTION:A conductor pattern 12 formed by solder-printing is provided on a substrate 11, and an LED array 3 whose side and upper surface are covered with cured resin of specified thickness is mounted on said conductor pattern. A positioning is performed in this case by abutting jigs 13 to obtain a reference plane previously set in a Y-direction while using an abutting 14 for an X-direction, respectively. A first LED array 3 is brought into contact with the jigs 13 and 14 to perform the positioning. A substrate 11 is heated and a solder is melted, so a die-bonding is performed at the same time with the positioning, and cured resin 5' also is melted and vaporized into the atmospheric air. A second LED array is carried whose Y- direction is regulated by abutting jig 13. As for the X-direction, the array is brought into contact with the side of the LED array 3 which has been mounted already, and then the positioning and die-bonding are performed. In the same manner, the LED array 3 is arranged and subjected to die-bonding. |
