| 摘要 |
<p>PURPOSE:To eliminate applying cream solder, etc., on the semiconductor device side near the print substrate and to eliminate printing, by providing with alloy solder necessary for bonding, on the semiconductor device, when it is mounted on the print substrate. CONSTITUTION:A plural of leads 2 are extracted transversely from all four sides of a sealing resin member 1, and are bended so as to form steps on the way, so that the tips of the leads 2 can be positioned at the same plane as the bottom face of the sealing resin member 1. On the tips to be fixed on the print substrate, melting plating such as tin or solder is preliminarily applied. Across the sections of the leads connecting to the print substrate, elongated tape-shaped solder pieces 3 are deposited with thermal pressing. The solder pieces 3 melted on the reflowing, is impregnated into between the leads 2 and the metal wiring on the print substrate to be bonded, and the bridges of the solder pieces 3 between the leads 2 are broken with the surface tension, to supply solder necessary for the bonding, between the leads 2 and the wiring on the print substrate.</p> |
