| 摘要 |
<p>The present invention is a method of counting automatically the number of etch pits by using a computerized image-processing technique, which comprises the steps of calculating the average unit area Ap of an isolated etch pit p on the surface of a semiconductor crystal substrate (wafer) for every wafer or at every measured point thereon, dividing the area Sk of a grouping of overlapping etch pits k by the average unit area Ap, rounding off the quotient to be an integer so as to obtain the number of etch pits nk included in the area Sk, and totaling the number of isolated etch pits u and the number of overlapping etch pits nk to obtain the total number of etch pits N on the wafer surface, so that the etch pits density on the wafer surface can be calculated.</p> |
