DISTORTION ELIMINATING METHOD FOR SEMICONDUCTOR BASE PLATE

摘要

PURPOSE:To eliminate the distortion of a semiconductor base plate with accuracy and automatically by supplying machining liquid having an etching property on the surface of a polishing plate and machining the semiconductor base plate keeping it a minute distance from the surface of the plate. CONSTITUTION:Machining liquid having an etching property is supplied continuously from a machining liquid nozzle 3 to the surface of the abrasive cloth 2 rotating on a disk shaped polishing plate 1 rotated by a motor or the like forming a machining liquid layer 4 on the abrasive cloth 2. And the holder 5 on the disk is stuck by a semiconductor base plate 6 on its face and is held at the center of another face so as to be rotated freely. In this case, the holder 5 and semiconductor base plate 6 are held on the machining liquid layer 4 at such a low level of pressure as to be floated with dynamic pressure or hold a minute chink mechanically between the base plate and liquid. Thus, this method allows to obtain more excellent surfaces in flatness than by conventional ways of etching and is suited for automated distortion dispelling.