DECOUPLING CAPACITOR AND MANUFACTURE THEREOF

摘要

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed from a lead frame which contains the four leads of the capacitor (two of which are electrically inactive) on a single plane. The use of a lead frame automatically provides the dimensional tolerances necessary for encapsulation molding of the decoupling capacitor. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a single layer ceramic capacitor, active leads bonded to the capacitor and dummy pins for auto-insertion into printed circuit boards.