| 摘要 |
PURPOSE:To improve accuracy of bonding position on the lead side and avoid malfunction of a pattern recognition apparatus by providing a lead pattern recognition mark for wire bonding on at least one of an inner lead or a tie-bar. CONSTITUTION:An island 11 on which a semiconductor element is mounted is supported by four tie-bars 12 provided at the corners. The other ends of the tie-bars 12 are linked with an outer frame 13. A lead pattern recognition mark 14 for wire bonding is provided on one of the four tie-bars 12. A plurality of inner leads 15 are provided around the island 11 and guide holes 16 are drilled in the outer frame 13. With this constitution, as the lead pattern recognition mark 14 for wire bonding is provided on the predetermined tie-bar 12, even if the lead frame is of a multi-pin structure, accurate bonding can be carried out by using the mark 14 as a guide sign without inducing malfunction of a pattern recognition apparatus. |
