| 摘要 |
PURPOSE:To accomplish a strong electric connection by a method wherein an electric connection between the electrode of a semiconductor pellet and an external terminal is made through a wiring layer formed on an insulative film. CONSTITUTION:After the internal end section of the wiring layer 8 of a film wiring 9 has been placed on an electrode pad 3a, and the external end section has been placed on the internal end section of the metalize 9 of a package substrate 1, a bonding jig is mounted on the polyimide film 7 above the wiring layer 8 so that an electric connection is easily accomplished with thermal pressure or application of ultrasonic vibration energy. Since the wiring layer 8 is lined with the film 7, reinforcement and fixing are accomplished, thereby preventing failures such as cutting due to the resonance with low frequency wave as in the case of wire and short-circuiting due to the wire touching even if the pattern in the wiring layer 8 is to be miniaturized. |
