发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the generation of blow holes on the sealing margin of a package by a method wherein an air-release hole passing from the inside to the outside of the cavity is opened in the package member, and the air release hole is filled with wax material. CONSTITUTION:After glass with low melting point 10 has been applied on the exposed part of the frame member 4c of a package substrate 4, a cap 9 is mounted. When the substrate is put in the sealing furnace to perform the sealing process, a cavity space 3 is highly pressurized by the thermal expansion and by gas produced from the polyimide resin. When 400 deg.C is reached, the glass with low melting point 13 as a filling material starts to soften, and gas or air presses the glass with low melting point 13 at the wax puddling section 12 from the air release hole 11 and flows out. After that, the glass with low melting point 10 starts to soften at about 430 deg.C. When the cap 9 is connected to the package substrate 4, it is taken out from the sealing furnace and cooled. At that time, air-tight sealing is performed since the glass with low melting point 13 hardens, blocking the air-release hole 11, thereby preventing the generation of blow holes in the sealing member of the sealing margin.
申请公布号 JPS6224646(A) 申请公布日期 1987.02.02
申请号 JP19850161956 申请日期 1985.07.24
申请人 HITACHI VLSI ENG CORP;HITACHI LTD 发明人 SATO KEIICHI;TSUBOI TOSHIHIRO;HONDA ATSUSHI
分类号 H01L21/54;H01L23/02;H01L23/04 主分类号 H01L21/54
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