| 摘要 |
PURPOSE:To suppress deterioration of moisture resistance and improve reliability by a method wherein the regions of lead members which are molded in a package containing a semiconductor chip are treated to have uneven surfaces. CONSTITUTION:The regions of lead members which are molded in a package containing a semiconductor chip are treated to have uneven surfaces. For instance, a bonding region 5 at the tip of an inner lead 3 is subjected to a surface treatment process so as to have fine unevenness of about 10mum on its surface. Moreover, plating of Au, Ag or the like is applied to the treated surface of the bonding region 5 in order to obtain satisfactory connection between the bonding region 5 and a bonding wire. With this constitution, when a semiconductor chip is molded with resin or the like and contained in a flat package, as surface treatment is applied to the bonding regions 5 of inner leads 3 to provide surfaces with fine unevenness, adhesion strength between the bonding regions 5 and the resin can be improved. |
