发明名称 LEAD FRAME
摘要 PURPOSE:To prevent the generation of clearances, etc. between a resin and a tab-hanging lead without being affected by differences among the thermal expansion and contraction of the resin and the tab-hanging lead on a resin molding by forming one part of an outer frame section at a position where it is not clamped by a mold on the resin molding. CONSTITUTION:A resin molding is conducted inside a section shown in a chain line 6. Since rigid structure has elasticity by shaping slits 8 to tab-hanging lead 2 connecting sections for a frame (an outer frame), the thermal expansion and contraction of a tab lead 2 are easy to follow up the curing and shrinkage of a resin, and residual stress on the interface between the lead frame-tab- hanging lead 2 and the resin can be reduced. The slits 8 are formed at positions where the lead frame 4 is not clamped by a mold on the resin molding, positions corresponding to a resin gate section and an air bend section, in the frame, thus effectively relaxing (thermal absorption) the thermal stress of the tab- hanging lead 2.
申请公布号 JPS6223139(A) 申请公布日期 1987.01.31
申请号 JP19850161856 申请日期 1985.07.24
申请人 HITACHI LTD 发明人 SHIMIZU KAZUO;KOBAYASHI SHUJI;SUZUKI MASARU
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
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