| 摘要 |
PURPOSE:To obtain the mother board for base having good base characteristics at low price by forming an alloy plated layer of a specific single body or composed of two kinds on at least one side of a stainless steel thin plate and subjecting the surface of the formed plated layer to a fusing process. CONSTITUTION:The step for forming an alloy plated layer of single body or two kinds out of Fe, Ni, Cr, Mo, Mn and Sn on at least one side of a stainless steel thin plate 0.5mm thick or under and the step for subjecting the surface of the formed plated layer to a fusing process are provided. Only the surface of the plated layer as the base material which has been subjected to the plating is fused. By this fusing step of the plated layer, the surface is made smooth even if it has received a minute and keen roughness during the plating step. If the components of plating bath are left and are remaining among the minute roughness of the base material as impurities as the result of the plating step, the fusing step removes them. |
