| 摘要 |
PURPOSE:To obtain a photosensitive composition having high sensitivity, high resolution and superior adhesion to a substrate, developable with a dil. aqueous alkali soln. after exposure and giving a photoset film having superior electrical and mechanical characteristics and superior characteristics as a solder resist by mixing a prescribed photopolymerizable compound with a prescribed amount each of specified compound. CONSTITUTION:This solid photosensitive resin composition contains 30-70wt% photopolymerizable compound (A) having at least one terminal ethylenic unsatd. double bond, 0.001-15wt% photopolymn. initiator (B), 30-70wt% copolymer (C) consisting of 1-25wt% alpha,beta-ethylenic unsatd. carboxylic acid, 5-20wt% monoolefinic unsatd. compound and 55-94wt% beta-ethylenic unsatd. carboxylic ester and 0.05-40wt% at least one kind of compound (D) selected among a compound (a) having at least one epoxy ring, a compound (b) contg. nitrogen, a tackifier (c) and aromatic, aliphatic or alicyclic petroleum resin (d). The photosensitive resin composition is used as a photoresist. |
