| 摘要 |
PURPOSE:To maintain the tensile strength of the bonding wires after the assembly even when the times of the needle contact is increased and to form a highly reliable semiconductor nonvolatile memory having no wire removal by a method wherein the first pads, and moreover, the second pads electrically connected to them are provided on the semiconductor chip. CONSTITUTION:First pads 3, and moreover, second pads 11 connected electrically with them are provided on the semiconductor chip. If the effective areas of the second pads 11 are made equal to those of the first pads 3, the second pads 11... are used for needle contact during the die-sorting as usual, and also, the first pads 3 are used for connection with enclosure terminals 4..., the effective areas of the Al wirings at the time of bonding are larger than the conventional ones even though the needle contact is repeated any times during the die-sorting, the tensile strength of the bonding wires is kept strongly and a wire removal can be prevented. |
