| 摘要 |
PURPOSE:To correctly indicate the mounting position of the pellet and to form a highly reliable semiconductor device by a method wherein the positioning pattern for indicating the mounting position of the pellet of the substrate is formed of a conductive material also serving as the wirings for power source supply. CONSTITUTION:A rectangle-shaped positioning pattern 7 is formed on the center part deeper than the lead wiring layers 6 on a packaged substrate 3. This positioning pattern 7 is formed by evaporating such a metal layer as an Al layer in the same manner as the lead wiring layers 6. Accordingly when the lead wiring layers 6 are formed, the positioning pattern 7 can be formed at the same time as the formation of the layers 6. The positioning pattern 7 keeps an electrical conduction with the prescribed lead wirings 6 at the prescribed positions, and the lead wiring 6 are electrically connected with the lead pins for power supply of lead pins 2 mounted on the back surface of the packaged substrate 3. Accordingly, the positioning pattern 7 is in a state that the supply voltage is impressed on the positioning pattern 7 via the lead pins for power supply.
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