| 摘要 |
PURPOSE:To improve the efficiency of resin seal work largely, to inhibit the strain of each die positively by a plurality of first and second hydraulic cylinders and to prevent the generation of a resin burr by mounting a bonding member coupled with an upper platen and a lower platen, a moving platen, first and second top forces, first and second bottom forces, and the hydraulic cylinders. CONSTITUTION:In the process of lifting of a moving platen 15, a first top force 21 and a first bottom force 20 are separated largely, a second top force 23 and a second bottom force 22 are pressed, and a semiconductor element is sealed with a resin. On the other hand, the semiconductor element sealed with the resin by the first top force 21 and the first bottom force 20 is removed at the same time. When the resin is cured, the moving platen 15 is transferred to the process of lowering, and a large space is formed between the second top force 23 and the second bottom 22 while the first top force 21 and the first bottom force 20 are transferred to the process of pressing. A first hydraulic cylinder 24 and a second hydraulic cylinder 25 each press both the first top force 21 and the first bottom force 20 and both the second top force 23 and the second bottom force 22, positively join the resins among both the dies 21 and 20 and both the dies 23 and 22, and prevent resin burrs, etc. |
