发明名称 MANUFACTURE OF LEAD FRAME FOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To mount easily a holder at a high precision in a given position on a lead frame, by providing an inner short rod, and removing the inner short rod after the holder is molded. CONSTITUTION:Under a condition in which inner leads 1 are connected by inner short rods 8 provided so as to surround the base stand 2, outer short rods 6, dam rods 5 and leads (the tips of the inner leads 1 and the base stand 2 are cut and separated), the lead frame is punched. Under this condition, since the inner leads 1 are fixed by the inner short rods 8, they are secured at designed positions even after press punching. After a pour of fluid insulating holder 7 is made by using a mold, it is cooled and hardened to hold the inner leads 1. Again by punching, the inner short rods 8 are cut. Where bonding onto the lead frame is done, the bonding may be done onto the inner leads 1 around the holder 7.
申请公布号 JPS6222466(A) 申请公布日期 1987.01.30
申请号 JP19850162231 申请日期 1985.07.22
申请人 NEC YAMAGATA LTD 发明人 KITAMURA NAOHIRO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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