SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要
An encapsulated semiconductor device wherein a semiconductor chip is mounted on a semiconductor chip mounting substrate with an adhesive having a curing start temperature of exothermic reaction of 130 DEG C or less measured by means of a differential scanning calorimeter on the assumption that the temperature rise rate is 10 DEG C/min. A method for manufacturing the same is also disclosed.
申请公布号
WO0007234(A1)
申请公布日期
2000.02.10
申请号
WO1999JP04016
申请日期
1999.07.27
申请人
HITACHI CHEMICAL COMPANY, LTD.;KOUSAKA, TAKASHI;SUZUKI, NAOYA;TANAKA, TOSHIAKI;YASUDA, MASAAKI;KANEDA, AIZOU