| 摘要 |
The coating, like coating (14), is produced by selectively depositing metals, like metals (16, 17), over an existing metallurgical pattern (3) supported on or recessed in a dielectric substrate (1). The coating is formed by the following steps. Sequentially blanket coating said substrate (1) and said pattern (3) with metals, like metals (16,17), being tuned to another in such a way that on heating a liquid metal or alloy layer, like alloy layer (18A), is formed adjacent the surface of substrate (1) and pattern (3) where said liquid layer wets said pattern (3) but not said substrate (1); heating the then present structure to a temperature where said liquid metal or said alloy layer, like layer (18A), is formed; cooling said structure; and removing said metals, like metals (16,17). from the surface of said substrate (1) not covered by said pattern (3). The method is applicable in selectively depositing a brazeable and solderable, protective metal coating on refractive metal conductive patterns on ceramic substrate carriers employed for mounting semiconductor devices. |
