Process for coating micro-indentations

摘要

When coating substrate surfaces which have so-called micro-indentations (grooves, holes) having a lateral extent of less than 5 mu m, especially those whose depth is greater than their width, there is a risk of cavities being formed in the indentations below a vapour-deposited layer. In order to avoid this, the coating is carried out, according to the invention, using coating material molecular beams, whose divergence must not exceed 10 DEG , and the coating material in the indentations is in part dusted off again by ion bombardment and thus is distributed more effectively on the side walls thereof. Application of the invention primarily in microelectronics.