| 摘要 |
<p>PURPOSE:To improve the cooling efficiency of semiconductor chips by mixing a diamond powder of high heat conductivity into the insulating gel, thereby reducing the heat resistance. CONSTITUTION:A diamond powder 8 of high heat conductivity is mixed into the insulating gel 9 for preventing the water infiltration to semiconductor chips 1, thereby reducing the heat resistance. Hereupon, the heat generated at chips 1 can be conducted through not only the projected electrodes 2 but also the gel 9, into which the diamond powder 8 is mixed, to a package substrate 6, further to dams 7 and a cap 10 so as to be dissipated. With this, the cooling efficiency of the chips 1 can be improved.</p> |
