发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To provide good electrical contact to the substrate to be packaged by forming a beveling portion at least on the edge in the portion of a package corresponding to the electrode, and intercepting the flowing out of the sealing material fluidized at the beveling portion to the portion corresponding to the electrode. CONSTITUTION:When a cap 11 is sealed to a base 3 using a low-melting fritted glass, the low-melting fritted glass melts on the heating using a sealing furnace or the like, becoming semifluid. the molten glass 13 having flowed out to the beveling portion 10 of the upper fringe of a pier 8 catches on the upper end sharp portion 10a of the beveling portion 10 because of its own surface tension, and is intercepted in a condition that is rounds itself up. If the molten glass 13 should climb over the upper end sharp portion 10a of the beveling portion 10, the glass 13 would stay in the inner space of the beveling portion 10. With this, the glass 13 is prevented from flowing into the pier 8.
申请公布号 JPS6221254(A) 申请公布日期 1987.01.29
申请号 JP19850160238 申请日期 1985.07.22
申请人 AKITA DENSHI KK;HITACHI LTD 发明人 SUDO TAKESHI
分类号 H01L23/04;H01L23/10;H01L23/50 主分类号 H01L23/04
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